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제품번호 : 7002, 7006
제품명 : 108 Auto Sputter Coater
메이커 : Ted Pella Inc.
첨부파일 :

108 Auto Sputter Coater

ideal for routine sample preparation for scanning electron microscopy



The 108 Auto Sputter Coater with 120mm Ø Chamber

The 108 Auto Sputter Coater is ideally suited for high quality coating of non-conducting samples for standard SEM imaging. The added functionality of the automatic features enable fine grain coating on a range of samples with a choice of target materials. The automatic purge and leak functions together with the optional MTM-20 High Resolution Thickness Controller offer consistent thickness for optimized conductive coating results. Cool, fine-grain sputtering is achieved with a very efficient low voltage DC magnetron head. The quick change target method allows a range of metals to be used.

Main Features

  • The 108 Auto Sputter Coater offers the choice of fully automated or manual operation. The specifications also include automatic vent (with a choice of vent gas) and argon purge control.
  • In automatic mode, the coater can be controlled in two ways. The digital timer can be used to give repeatable coatings or the MTM-20 High Resolution Thickness Controller (optional) can be used to terminate the sputtering process at the desired thickness. Alternatively, the MTM-10 High Resolution Thickness Monitor (optional) may also be used for manual termination.
  • The digital sputter current control is fully independent of the argon gas pressure in the sputtering chamber to achieve consistent sputtering rates and optimum specimen coverage.
  • The efficient DC magnetron operates on a low voltage for "ultra-cool" sputtering to avoid effects on sample surface.
  • Separate electronic valves for leak, purge and vent, coupled with a precise needle valve, ensures quick and easy operation.
  • Quick target change allows for a range of materials used: Au, Au/Pd, Pt, Pt/Pd (Au fitted as standard).
  • The 108 Auto Sputter Coater can be factory fitted or retrofitted at any time with our Prod. No. 93007, MTM-20 High Resolution Thickness Controller (optional).

108 Auto Sputter Coater Accessories & Consumables
RT Stage Accessories Vacuum Systems Targets Single & Dual Connetion Kits MTM-10 Thickess Monitor


Specifications for the 108 Auto Sputter Coater

Chamber size 120mm OD x 120mm height (4.75 x 4.75")
Target Au fitted as standard, Au:Pd, Pt, Pt:Pd optional; 57mm dia x 0.1mm thick
Sample table Holds 12 SEM pin mounts; Height adjustable through 60mm
Sputter supply Microprocessor based, safety interlock, variable, 40mA maximum
Programmable digital control
Sputter head Low voltage "ultra-cool" planar magnetron
Quick target change
Wrap-around dark-space shield
Analog metering Vacuum Atm - 0.001mb
Thickness monitoring Use automatic terminating MTM-20 High Resolution Thickness Controller or MTM-10 High Resolution Thickness Monitor (manual terminating)
Control method Automatic operation of gas purge and leak functions
Automatic process sequencing
Full manual override
Precision needle valve
Digital timer (0-300 sec) with pause
Automatic vent
Desktop system Vacuum pump is mounted on desktop compatible anti-vibration table
All metal integrated coupling system
Electrical 100-120 or 200-240 VAC, 50/60Hz (specify on order)
Power 500VA (coater and pumping system #7010 together)
Argon gas Purity, min. 99.99%
Working pressure 5-6 psi (0.4 bar)
Hose connection, 6.0mm (1/4")


Footprint (Height: 280mm)


Dimensions (mm)
1. Control unit / 2. Vacuum chamber / 3. Thickness monitor / 4. Rotary pump / 5. Anti-vibration base



Order Information

Product no. Description
7002 108 Auto Sputter Coater, 115V
7006 108 Auto Sputter Coater, 220V

*The 108 Auto Sputter Coater includes: 91110 Gold Target, (57mm dia. x 0.1mm); 7021 Specimen Mount Stage for 12 pin mounts; Operating Instructions






How do the 108 Auto and the 108 Auto/SE compare?
108C Auto/SE

108C Auto
1. Increased chamber diameter
Chamber size has been increased to permit coating of larger samples. Standard Chamber 150mm diameter x 165mm
150mm Ø 120mm Ø
2. Target shutter
Target shutter has been added to condition special targets prior to coating
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3. Variable chamber geometry (option)
Adjustable chamber height is used to improve coating uniformity and vary the deposition rate
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4. Sample stage movements (option)
Separate rotary, planetary and tilting sample movements to optimize coating distribution and coverage.
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5. Superior sputter head design
Stronger magnetic field for improved deposition rate.
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